>> Final Paper Submission will start from 21 Feb. 2018.
>> Registration is open.
During 14 Feb. to 19 Feb., the conference secretary office will be closed for Chinese New Year holiday. Answers to queries from delegates are expected to be delayed; the secretary will tend to you from 20 Feb. onwards. Thank you for your kind understanding.
The 2018 Joint IEEE International Symposium on Electromagnetic Compatibility & Asia-Pacific Symposium on Electromagnetic Compatibility (2018 Joint IEEE EMC & APEMC) will take place at the Suntec Convention and Exhibition Center in Singapore from 14 to 17 May 2018.
The joint symposium combines the 60th IEEE International Symposium on EMC with the 9th APEMC Symposium. For the former, it is only the 4th time for it to be held outside the North America Continent in 60 years and the first time in Asia over the past three decades. For the latter, it is a homecoming to where the APEMC originated 10 years ago.
The symposium Technical Program Committee invites you to submit your original and unpublished papers and/or abstracts in all aspects of electromagnetic compatibility (EMC) as well as signal and power Integrity (SI/PI), including but not limited to EMC/SI/PI design, modeling, management, measurements, and education. All eligible papers will be published online at the IEEE Xplore, as conference proceedings, in a special issue of IEEE Transactions on Electromagnetic Compatibility and IEEE EMC Magazine.
Plan ahead and join this unique symposium, meet international colleagues, present your latest research findings, share your insight and perspectives, ask questions, learn from experts and innovators, explore collaborations, visit exhibitions and see new products. Experience Singapore, where east meets west, and much more!
Copyright © 2018 Joint IEEE EMC & APEMC